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400 Point Solderless Breadboard
₹39
400 tie-point solderless breadboard – build and test circuits quickly without soldering.
Availability: ✓ In Stock
Availability: 100 in stock
🛒 Go to Cart| Qty | Unit Price (INR) | Ext. Price |
|---|---|---|
| 1 | ₹39 | ₹39 |
| 10 | — | — |
| 100 | — | — |
Product Specifications
Tie Points: 400
Pitch: 2.54 mm
Body Material: PP plastic
Backing: Self-adhesive
Accepted Wire Gauge: 20-29 AWG
Product Details
400 tie-point solderless breadboard – build and test circuits quickly without soldering.
Key Features
- 400 tie points with power rails on both sides
- Standard 2.54 mm pitch for DIP ICs and modules
- Self-adhesive backing
- Can be joined with other breadboards
Typical Applications
- Prototyping Arduino and ESP circuits
- Electronics learning and labs
- Testing sensors and modules
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